描述

2.2還書入箱
書架滿，但是書箱中還有空間放置圖書時，系統(tǒng)執(zhí)行還書入箱操作流程，還書入箱操作主流程描述如下：讀者歸還圖書讀取操作上位機(jī)向PLC發(fā)送開門指令——>自動門打開——>讀者放入圖書——>門口機(jī)傳感器獲得圖書檢測信號、條碼掃描槍獲取圖書正反信息——>關(guān)閉自動門——>讀取圖書標(biāo)簽——>根據(jù)圖書正反翻轉(zhuǎn)圖書——>圖書翻轉(zhuǎn)完成、獲取圖書大小信息——>根據(jù)圖書大小信息分配圖書架位號——>如果書架滿則向機(jī)械手發(fā)送圖書入箱指令——>機(jī)械手把圖書放入回收箱中。
3.新書上架
新書上架指圖書管理員對新到圖書或從圖書館中心庫中提取到得新圖書進(jìn)行上架，通過機(jī)械手把圖書擺放到自助圖書館系統(tǒng)書架上。
3.1新書上架流程
自助圖書館圖書管理員新書上架主流程簡略描述如下：上位機(jī)向PLC發(fā)送開門指令——>圖書管理員放入圖書——>門口機(jī)傳感器獲得圖書檢測信號、條碼掃描槍獲取圖書正反信息——>關(guān)閉自動門——>讀取圖書標(biāo)簽——>根據(jù)圖書正反翻轉(zhuǎn)圖書——>圖書翻轉(zhuǎn)完成、獲取圖書大小信息——>根據(jù)圖書大小信息分配圖書架位號——>上位機(jī)向PLC發(fā)送圖書上架指令——>PLC控制機(jī)械手進(jìn)行圖書上架。

歐美品牌停產(chǎn)的，常用的“PLC”備品備件

我司產(chǎn)品應(yīng)用于以下領(lǐng)域：

1,《發(fā)電廠DCS監(jiān)控系統(tǒng)》

2,《智能平鋼化爐系統(tǒng)制造》

3,《PLC可編程輸送控制系統(tǒng)》

4,《DCS集散控制系統(tǒng)》
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5,《智能型消防供水控制系統(tǒng)》

6,《化工廠藥液恒流量計算機(jī)控制系統(tǒng)》

7,《電氣控制系統(tǒng)》造紙,印染生產(chǎn)線,變電站綜合自動化控制系列

本特利，英維思，伍德沃德，?？怂共_、西屋、瑞恩、施耐德莫迪康、ABB、AB、西門子、摩托羅拉、GE發(fā)那科、安川、博世力士樂，ACSO，力士樂等各大品牌的DCS系統(tǒng)配件，機(jī)器人系統(tǒng)配件，大型伺服系統(tǒng)備件。

C71219 Westbond 7416A Thermocompressi?on Ribbon Bonder

C59153 Electroglas 2001X Wafer Prober Probe Station

A69438 Applied Materials 8300 Plasma Etch Chamber/Parts

C68471 Signatone CAP-463 Computer Aided 6″Wafer Prober

C69868 Westbond 7416A Thermocompressi?on Wedge Bonder

C69867 Westbond 7700A Deep Access Ball&Wedge Bonder

C64997 Westbond 7416A Thermocompressi?on Wedge Bonder

C70110 Westbond 7700A Deep Access Ball&Wedge Bonder

C70147 Westbond 7200B Pick&Place Epoxy Die Bonder

C70442 Westbond 7700A Ultrasonic Ball&Wedge Bonder

A52247 Inficon UL500 Dry Leybold,Anest Iwata Vac Pump

G53925 Olympus Measuring Microscope System

A72283(3)Tokyo Electron P-8XL Wafer Probers,P-8

C30694 Dage Microtester 22 Wire Shear/Pull Tester BT22

L70134 Kensington Zeiss Wafer Inspection Station

GE43031 Tesec 9210-IH Ambient/Hot IC Handler

GE43128 Tesec 9210-IH.T Ambient/Hot IC Handler

GE43127 Tesec 9210-IH/T Ambient/Hot IC Handler

GE43074 Tesec 9210-IH.T Ambient/Hot IC Handler

GE43073 Tesec 9210-IH Ambient/Hot IC Handler

C69771 Westbond 7316A Eutectic Mech.Scrub Die Bonder

C69694 Westbond 7316A Multiple-Collet Scrub Die Bonder

C69695 Westbond 7300A Eutectic Ultrasonic Die Bonder

C52697 Aetrium 5050S IC Handler for.208mil SSOP

C50941 Electroglas Horizon 4085X Automatic 8″Prober

A55030 Boc Edwards QMB250F Booster w QDP40 Dry Pump

A55032 Boc Edwards QMB250F Booster w/QDP40 Pump

A55031 Boc Edwards QDP40 Vacuum Pump w QMB250F Booster

A59162(2)Credence SC212 Micro Tester System

G69672 K&S(Kulicke&Soffa)1471 Automatic Wire Bonder

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C69225 Mech-El 990 Vertical Feed Wedge Wire Bonder

A24760 SRT MP1000F-IR Chip Bonder/Rework Station,PCB

A24698 Wentworth Laboratories MP2010 Manual Prober,8″

C71102 Alessi REL-4100A 8″Wafer Prober/Probe Station

C52699 Seiko Epson HM-3500 High Speed IC Handler

C52690 Synax SX1201 Pick&Place IC Handler

C71103 Wyko MHT Magnetic Head Tester w/Multi-Axis Stage

A73253 Groton Biosystems Automated Sampling System,ARS

A73252 Packard Topcount NXT Scintillation Counter

A69803 Sonix HS1000 Ultrasonic Microscope HS-1000

G73927 HP G1315A DAD Diode-Array Detector

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A60694 Varian 3400 w/Finnigan Mass Spectrometer

A59351 Nanotech 380FDCR Lapping Machine

C30414 K&S(Kulicke&Soffa)1484 Automatic Wire Bonder

C52688 TSK A-PM-90AL Automatic 8″Wafer Probing Prober

C69941 Westbond 7440A Insulated Wire Bonder Tacker

C67229 Mech-El 907 1mil Wire Vertical Feed Wedge Bonder

C52686 TSK A-PM-90A Automatic 8″Wafer Prober

C70111 Mech-El 990 Vertical Feed Wedge Wire Bonder

C74726 Westbond 2400 Automatic Wedge 45°Wire Bonder

C66463 Signatone S-1160 Wafer Prober Probing Station

C50995 Isel Robotik Wafer Handling Robot Newly Upgraded

C70446 Mech-El 907 Manual Wedge Wire Bonder

K72905 TempTronic TP04000A-1B21-2 Temp Forcing System

C69770 Westbond 7200A Pick&Place Epoxy Die Bonder

C30499 Dage BT23 Shear Tester w/LC200 Load Cell

C68246 HP 54845A Infiniium 1.5GHz 8GSa/s Oscillscope

C64996 Westbond 7200AA Pick&Place Epoxy Die Bonder

K73456 POLYVAR-MET Microscope 30 06 04 AO/Reichert