描述

3．FX2N–10GM和FX–20GM定位控制器

FX2N–10GM是單軸定位單元，F(xiàn)X–20GM是雙軸定位單元，可執(zhí)行直線插補(bǔ)、圓弧插補(bǔ)，或獨(dú)立雙軸控制，可以獨(dú)立工作，不必連接到PLC上。有絕對(duì)位置檢測(cè)功能和手動(dòng)脈沖發(fā)生器連接功能，具有流程圖的編程軟件使程序設(shè)計(jì)可視化。

最高輸出頻率為200kHz，F(xiàn)X–20GM插補(bǔ)時(shí)為100kHz,在程序中占用8個(gè)輸入輸出點(diǎn)。

4．可編程凸輪控制單元FX–1RM–SET

在機(jī)械控制系統(tǒng)中常常需要通過(guò)檢測(cè)角度位置來(lái)接通或斷開外部負(fù)載，以前用機(jī)械式凸輪開關(guān)來(lái)完成這種任務(wù)。它對(duì)加工精度的要求高，易于磨損。

可編程凸輪控制單元FX–1RM–SET可實(shí)現(xiàn)高精度角度位置檢測(cè)。它可以進(jìn)行動(dòng)作角度設(shè)定和監(jiān)視?？稍贓EPROM中存放8種不同的程序。配套的無(wú)刷轉(zhuǎn)角傳感器的電纜最長(zhǎng)可達(dá)100m。在程序中占用8個(gè)I/O點(diǎn)。通過(guò)連接晶體管擴(kuò)展模塊，可以得到最多48點(diǎn)的ON／OFF輸出?？捎猛ㄐ沤涌谀K將它連接到CC–link網(wǎng)絡(luò)。

歐美品牌停產(chǎn)的，常用的“PLC”備品備件

我司產(chǎn)品應(yīng)用于以下領(lǐng)域：

1,《發(fā)電廠DCS監(jiān)控系統(tǒng)》

2,《智能平鋼化爐系統(tǒng)制造》

3,《PLC可編程輸送控制系統(tǒng)》

4,《DCS集散控制系統(tǒng)》
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5,《智能型消防供水控制系統(tǒng)》

6,《化工廠藥液恒流量計(jì)算機(jī)控制系統(tǒng)》

7,《電氣控制系統(tǒng)》造紙,印染生產(chǎn)線,變電站綜合自動(dòng)化控制系列

本特利，英維思，伍德沃德，?？怂共_、西屋、瑞恩、施耐德莫迪康、ABB、AB、西門子、摩托羅拉、GE發(fā)那科、安川、博世力士樂(lè)，ACSO，力士樂(lè)等各大品牌的DCS系統(tǒng)配件，機(jī)器人系統(tǒng)配件，大型伺服系統(tǒng)備件。

C62291 Rucker&Kolls R&K 691 Automatic Wafer Prober

CT71086 Karl Suss Wafer Prober Probe Station w/Wild M3Z

K74410 GE LUNAR Prodigy 8743 Bone Densitometer Density

C59276 Orthodyne 20B Ultrasonic Large Wire Bonder

C69693 K&S 4129 Deep Access 90°Wedge Wire Bonder

C64901 K&S Kulicke Soffa 4126 Step-Back Wedge Bonder

C59003 K&S 4123 Manual Wedge Wire Bonder(Refurbished)

C58972 K&S 4123 Manual Wedge Wire Bonder(refurbished)

A73229 Beckman Coulter DU 800 UV/Vis Spectrophotomet?er

C69596 Westbond 7400A Deep Access Vertical Feed Bonder

C64574 HTG 84-3(350W)UV Lamp Mask Aligner w/Power Sup

G51906 Wentworth Labs.MP2000 8″Probe Station

C71219 Westbond 7416A Thermocompressi?on Ribbon Bonder

C59153 Electroglas 2001X Wafer Prober Probe Station

A69438 Applied Materials 8300 Plasma Etch Chamber/Parts

C68471 Signatone CAP-463 Computer Aided 6″Wafer Prober

C69868 Westbond 7416A Thermocompressi?on Wedge Bonder

C69867 Westbond 7700A Deep Access Ball&Wedge Bonder

C64997 Westbond 7416A Thermocompressi?on Wedge Bonder

C70110 Westbond 7700A Deep Access Ball&Wedge Bonder

C70147 Westbond 7200B Pick&Place Epoxy Die Bonder

C70442 Westbond 7700A Ultrasonic Ball&Wedge Bonder

A52247 Inficon UL500 Dry Leybold,Anest Iwata Vac Pump

G53925 Olympus Measuring Microscope System

A72283(3)Tokyo Electron P-8XL Wafer Probers,P-8

C30694 Dage Microtester 22 Wire Shear/Pull Tester BT22

L70134 Kensington Zeiss Wafer Inspection Station

GE43031 Tesec 9210-IH Ambient/Hot IC Handler

GE43128 Tesec 9210-IH.T Ambient/Hot IC Handler

GE43127 Tesec 9210-IH/T Ambient/Hot IC Handler

GE43074 Tesec 9210-IH.T Ambient/Hot IC Handler

GE43073 Tesec 9210-IH Ambient/Hot IC Handler

C69771 Westbond 7316A Eutectic Mech.Scrub Die Bonder

C69694 Westbond 7316A Multiple-Collet Scrub Die Bonder

C69695 Westbond 7300A Eutectic Ultrasonic Die Bonder

C52697 Aetrium 5050S IC Handler for.208mil SSOP

C50941 Electroglas Horizon 4085X Automatic 8″Prober

A55030 Boc Edwards QMB250F Booster w QDP40 Dry Pump

A55032 Boc Edwards QMB250F Booster w/QDP40 Pump

A55031 Boc Edwards QDP40 Vacuum Pump w QMB250F Booster

A59162(2)Credence SC212 Micro Tester System

G69672 K&S(Kulicke&Soffa)1471 Automatic Wire Bonder

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C69225 Mech-El 990 Vertical Feed Wedge Wire Bonder

A24760 SRT MP1000F-IR Chip Bonder/Rework Station,PCB

A24698 Wentworth Laboratories MP2010 Manual Prober,8″

C71102 Alessi REL-4100A 8″Wafer Prober/Probe Station

C52699 Seiko Epson HM-3500 High Speed IC Handler

C52690 Synax SX1201 Pick&Place IC Handler

C71103 Wyko MHT Magnetic Head Tester w/Multi-Axis Stage

A73253 Groton Biosystems Automated Sampling System,ARS

A73252 Packard Topcount NXT Scintillation Counter

A69803 Sonix HS1000 Ultrasonic Microscope HS-1000

G73927 HP G1315A DAD Diode-Array Detector

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A60694 Varian 3400 w/Finnigan Mass Spectrometer

A59351 Nanotech 380FDCR Lapping Machine

C30414 K&S(Kulicke&Soffa)1484 Automatic Wire Bonder